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    膠帶材料

    首頁 > 產品 > 膠帶材料 > 膠帶 > 熱激活膠帶
    熱激活膠帶
    提供各種膠帶,由PET、無紡布、泡沫、涂有丙烯酸、硅樹脂、橡膠、熱熔、熱轉化粘合劑的PI基材制成。可提供各種寬度、長度和釋放襯墊,以滿足特定需求,專為工業(yè)、商業(yè)和家庭應用的特殊環(huán)境而設計。
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    Product P/N Total Thickness
    (um)
    Type Carrier Bonding Strength MPa SUS/SUS Soft Point (℃) Color Adhesive Type Pre-Lamination Recommended Bonding Conditions Feature/Application
    HT Series
    HT6501 10 Double-sided E >2 50-70 Transparent Thermal
    Setting
    Glue Line
    Temperature.
    50-70°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    2-4 Bar
    Glue Line
    Temperature:
    min.120°C
    Dwell Time:
    30-120 Seconds
    Pressure:
    2.8-5 Bar
    1.Weak adhesion at room temperature, good adhesion to metal, glass and PI after curing
    2.Good impact performance and heat/moisture resistance
    3.No further post-curing is required after thermal activation during bonding
    HT2013P 130 Single-sided  PI/PET >7 Amber/Black
    Thermal
    Setting
    2 kg rubber hand roller 5 mm/s, 3 times in each direction
    150℃*10min+180℃*20min Electrical insulation;Cooling Plate
    HT5601 10 Double-sided none >3 90-120 Transparent Thermal
    Setting
    Glue Line
    Temperature.
    35-130°C
    Dwell Time:
    5-30 Seconds
    Pressure:
    3-11 Bar
    Glue Line
    Temperature:
    170-200°C
    Dwell Time:
    10-30 min
    Pressure:
    3-11 Bar
    1.High temperature resistance after curing
    2.Outstanding resistance against chemicals
    3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
    4.Easy handling performance for die cutting
    HT5602 20 Double-sided none >4 90-120 Transparent Thermal
    Setting
    Glue Line
    Temperature.
    35-130°C
    Dwell Time:
    5-30 Seconds
    Pressure:
    3-11 Bar
    Glue Line
    Temperature:
    170-200°C
    Dwell Time:
    10-30 min
    Pressure:
    3-11 Bar
    1.High temperature resistance after curing
    2.Outstanding resistance against chemicals
    3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
    4.Easy handling performance for die cutting
    HT5610 100 Double-sided none >20 90-120 Transparent Thermal
    Setting
    Glue Line
    Temperature.
    50-70°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    2-4 Bar
    Glue Line
    Temperature:
    180-200°C
    Dwell Time:
    10-30 min
    Pressure:
    2-5 Bar
    1.High temperature resistance after curing
    2.Outstanding resistance against chemicals
    3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
    4.Easy handling performance for die cutting
    LT Series
    LT0100B 100 Double-sided none >5 45-60  Black Thermal
    Setting
    Glue Line
    Temperature.
    50-60°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    2-4 Bar
    Glue Line
    Temperature:
    min.75°C
    Dwell Time:
    30-120 Seconds
    Pressure:
    2.8-5 Bar
    1. Extremely strong bonding for leather, PC. metal, etc.
    2. Activated at low temperature and pressure
    3. Thermal setting type, can't be re-activated
    LU Series
    LU2305 50 Double-sided none >10 / Transparent UV
    Setting
    2 kg rubber hand roller 5 mm/s, 3 times in each direction
    70mW 365nm LED@60sec  70℃@3hrs
    1.Tackiness at room temperature for handling
    2.UV curing of opaque substrates
    3.Can be heat accelerated to reduce curing time
    4.Have good strength and reliability on metals, plastics, textiles, and glass
    LU2311L 110 Single-sided  PET >5 / Blue UV
    Setting
    2 kg rubber hand roller 5 mm/s, 3 times in each direction
    70mW 365nm LED@60sec  70℃@3hrs
    Electrical insulation
    TP Series
    TP3002 20 Double-sided none >2 90-120 Transparent Thermal
    Setting
    Glue Line
    Temperature.
    50-70°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    2-4 Bar
    Glue Line
    Temperature:
    min.140°C
    Dwell Time:
    30-120 Seconds
    Pressure:
    2.8-5 Bar
    1.Weak adhesion at room temperature, good adhesion to metal, glass and PI after curing
    2.Good impact performance and heat/moisture resistance
    3.No further post-curing is required after thermal activation during bonding
    4.Zero emissions, zero VOC
    TL Series
    TL5010 100 Double-sided none >2 50-80 Transparent Thermal
    Setting
    Glue Line
    Temperature.
    25-70°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    1-5 Bar
    Glue Line
    Temperature:
    70-100°C
    Dwell Time:
    5-60 s
    Pressure:
    1-5 Bar
    1.Tack at room temperature applicable as a pressure sensitive tape
    2.Outstanding resistance against heat and chemicals
    3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after activation.
    4.Easy handling performance for die cutting
    TL5025B 250 Double-sided none >2 50-80 Black Thermal
    Setting
    Glue Line
    Temperature.
    25-70°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    1-5 Bar
    Glue Line
    Temperature:
    70-100°C
    Dwell Time:
    5-60 s
    Pressure:
    1-5 Bar
    1.Tack at room temperature applicable as a pressure sensitive tape
    2.Outstanding resistance against heat and chemicals
    3.Good adhesion on SUS, AL, PI, PC, Glass and black coating Glass after activation.
    4.Easy handling performance for die cutting
    EM Series 50-100 Double-sided Cu/none >7 90-120 Brownish red Thermal
    Setting
    Glue Line
    Temperature.
    50-70°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    2-4 Bar
    Glue Line
    Temperature:
    180-200°C
    Dwell Time:
    10-30 min
    Pressure:
    2-5 Bar
    1.High temperature resistance after curing
    2.Outstanding resistance against chemicals
    3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
    4.Easy handling performance for die cutting
    5.Good conductivity
    TM Series 50-100 Double-sided none >7 90-120 White Thermal
    Setting
    Glue Line
    Temperature.
    50-70°C
    Dwell Time:
    5-15 Seconds
    Pressure:
    2-4 Bar
    Glue Line
    Temperature:
    180-200°C
    Dwell Time:
    10-30 min
    Pressure:
    2-5 Bar
    1.High temperature resistance after curing
    2.Outstanding resistance against chemicals
    3.Good adhesion on metals, glass, ceramic materials, textiles, and polymer film after curing.
    4.Easy handling performance for die cutting
    5.Good thermal conductivity

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